Huawei has officially confirmed that its upcoming Mate 90 series will feature a chip with performance close to 3nm technology.
The announcement came from Zheng Jun, CTO of Huawei's financial systems division, during the 20th Shenzhen International Financial Expo.
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Zheng Jun described the new chip platform as based on the Tau (τ) design principle.
He emphasized that this approach goes beyond manufacturing theory, representing a comprehensive redesign of chip engineering and supply chain coordination.
The chipset has already been integrated into the Mate 90 lineup.
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Reports indicate it may launch commercially as the Kirin 9050 Pro, though Huawei has not finalized the branding.
A key feature of the processor is its logic stacking architecture. Instead of relying solely on smaller geometric scaling, it vertically layers key logic circuits.
This reportedly improves transistor density by 53.5 percent, reaching about 238 million transistors per square millimeter.
Performance levels are said to be close to Intel's 18A process and early-generation TSMC 3nm technology.
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Huawei also claims a 41 percent improvement in power efficiency on performance cores, along with a 12.7 percent increase in peak clock speeds.
Beyond the chipset, the Mate 90 series is expected to focus on flagship-grade performance and AI capabilities.
Leaks suggest the smartphone lineup could debut officially in September this year.
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If these claims hold true, the Mate 90 may become one of Huawei's most ambitious flagship launches in recent years.
