Qualcomm and MediaTek are gearing up for a crucial showdown this year. Both companies are preparing to unveil their first chips built on a 2nm process node.
The Snapdragon 8 Elite Gen 6 and Dimensity 9600 will be among the first smartphone chipsets to leverage TSMC's most advanced fabrication technology.
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This shift is expected to bring significant reductions in power consumption and improved thermal efficiency.
Launch timeline
Qualcomm is expected to announce its new chips at the Snapdragon Summit, scheduled from September 22 to 24.
Alongside the standard Snapdragon 8 Elite Gen 6, a Pro variant is also anticipated.
MediaTek has not yet confirmed a date for its next event. However, the company typically holds its launch a few days before Qualcomm's.
Leaks suggest the Dimensity 9600 series could arrive around the second or third week of September.
MediaTek is reportedly planning multiple variants in the Dimensity 9600 lineup. Rumors point to at least three models: the standard Dimensity 9600, Dimensity 9600 Pro, and Dimensity 9600s.
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Some leaks even suggest MediaTek might skip the standard version and instead launch Dimensity 9600s, Dimensity 9600 Pro, and Dimensity 9600 Pro Max.
These details remain unconfirmed.
CPU and GPU architecture
Both chipsets are said to adopt a new "2+3+3" CPU layout, prioritizing efficiency over raw performance.
The Snapdragon 8 Elite Gen 6 will use custom-designed Oryon cores, while the Dimensity 9600 will rely on next-generation ARM cores.
Qualcomm's chip is rumored to include 16MB of L2 cache and 6MB of system-level cache.
For graphics, it will feature an Adreno 845 GPU with 12MB of dedicated graphics memory (GMEM).
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The Dimensity 9600 is expected to pack ARM's next-generation Immortalis GPU, codenamed "Magni."
This GPU is said to offer hardware-level frame generation, enabling games running at 60fps to be upscaled to 120fps directly on the silicon, reducing latency compared to software-based interpolation.
Memory, storage, and connectivity
Both chipsets are expected to support LPDDR5X memory and UFS 5.0 storage.
On the connectivity front, the Snapdragon 8 Elite Gen 6 will feature an upgraded Snapdragon X90 5G modem with advanced AI hardware on the baseband.
Leaks suggest peak cellular speeds could reach 15Gbps, up from 12.5Gbps on the previous generation.
Details about the Dimensity 9600's connectivity upgrades have not yet surfaced in leaks. Both chips are also expected to support Wi-Fi 8 and Bluetooth 7.
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As official announcements approach, more details are likely to emerge. This comparison will be updated as new information becomes available.
