Xiaomi's second mobile chipset, the Xring O3, is positioning itself against MediaTek's Dimensity 9500 in the high-end segment.
A spec and benchmark comparison shows Xiaomi's chip leading in CPU and graphics tests, though both chips share a 3nm TSMC process.
Specifications at a Glance
The Xring O3 was announced in August 2026, while the Dimensity 9500 arrived in September 2025.
Xiaomi's chip packs 24 billion transistors into a 133 mm² die, whereas the Dimensity 9500 has a die size of roughly 140.79 mm².
The Xring O3 uses a 10-core CPU: two C1-Ultra cores at 4.35 GHz, four C1-Premium cores at 3.68 GHz, and four C1-Pro cores at 3.15 GHz.
The Dimensity 9500 has an 8-core CPU with one C1-Ultra at 4.21 GHz, three C1-Premium at 3.5 GHz, and four C1-Pro at 2.7 GHz.
For graphics, the Xring O3 carries a 16-core Mali-G2 Ultra NX MP16 clocked at 1600 MHz, based on Valhall 6th gen architecture.
The Dimensity 9500 uses a 12-core Mali-G1 Ultra MP12 at 1716 MHz with Valhall 5th gen architecture.
Both chips include an NPU, but Xiaomi's offers 200 TOPS versus 100 TOPS on the MediaTek chip.
Memory support differs: the Xring O3 uses LPDDR6 up to 5333 MHz, while the Dimensity 9500 relies on LPDDR5X up to 5333 MHz.
Storage options are UFS 4.1 for the Xring O3 and UFS 4.0 or UFS 4.1 for the Dimensity 9500.
Connectivity on the Xring O3 includes a MediaTek T900 5G modem, Wi-Fi 7, and Bluetooth 6.0.
The Dimensity 9500 also supports Wi-Fi 7 and Bluetooth 6.0, with a MediaTek 5G modem rated for 7.4 Gbps peak download speed.
Benchmark Results
Benchmark figures for the Xring O3 come from a Chinese reviewer, Xiaobi's Tech, while Dimensity 9500 tests were run on a Vivo X300 Pro.
On Geekbench v6, the Xring O3-powered Xiaomi Pad 9 Pro Max scored 3,699 in single-core, about 7% higher than the Dimensity 9500's 3,452.
The multi-core gap is larger: the Xring O3 reached 14,350 points against 10,128 for the Dimensity 9500, a 41% difference.
