Samsung has restarted development of its 1.4nm process technology, codenamed SF 1.4, according to a report by The Bell.
The company now targets mass production in 2029, a delay from the original 2027 timeline.
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TSMC and Intel currently lead in 1.4nm-class foundry technologies. TSMC's node is called A14, while Intel refers to its offering as Intel 14A.
Despite the same nanometer label, each process is fundamentally different.
Samsung's strategy to catch up
Samsung has asked key equipment suppliers, including Applied Materials and Lam Research, to begin early development on tools for the SF 1.4 process.
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These tools are used across Samsung's foundry and memory operations. The first set will be delivered to NRD-K, Samsung's advanced R&D center for semiconductors.
The company originally planned to mass-produce 1.4nm chips in 2027 but delayed the timeline to strengthen its 2nm processes, such as SF2 and SF2P.
Samsung achieved high yields on its 2nm node and secured orders for Tesla's next-generation AI chips. With that foundation, it is now moving forward with 1.4nm preparations.
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ASML has delivered its next-generation High NA EUV lithography system to NRD-K. Samsung plans to use it on select layers starting with the 1.4nm process.
The company has also ordered equipment for its next-generation V12 NAND, expected to enter mass production around 2030.
Intel aims to begin mass production of 1.4nm chips in 2027, while TSMC targets full-scale production in 2028.
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That puts Samsung one to two years behind its rivals. However, Samsung holds an advantage over TSMC, as the latter is not yet using high-NA EUV tools.
