Xiaomi has introduced a prototype mini-PC called the AI Cube, built to run its large language models locally.
The device was unveiled at the XRING Chip Technology Communication Conference and is powered by three proprietary chips: XRING O3, XRING O100, and XRING D100.
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The XRING O3 serves as the main AI SoC, featuring a 10-core all-big-core CPU, a 16-core G2-Ultra NX GPU, and a 200 TOPS low-power NPU.
The XRING O100 is a high-bandwidth AI acceleration chip built on 6nm 3D wafer-level stacking, with 28,672 effective data lines and near-memory computing bandwidth up to 1.22TB/s.
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The XRING D100 is a 3nm chip designed for intelligent driving workloads, with a 20-core high-performance CPU, a 16-core NPU, and support for up to 160GB of memory.
The AI Cube features an aerospace-grade aluminum unibody casing with 33,874 CNC precision cutouts and can sustain up to 150W of continuous power.
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The hardware is intended for local deployment of large models ranging from 3B to 120B parameters, with a toggle to switch between fast and slow system modes.
This puts it in similar territory to the Tiiny AI Pocket Lab, which also runs 120B-parameter models locally, but Xiaomi uses its own chips instead of third-party silicon.
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The AI Cube remains a prototype, with no release date or price announced yet.
