Xiaomi's upcoming foldable, the Xiaomi 18 Fold, has been spotted on Geekbench AI, giving us a first look at its AI capabilities and hardware details.
The device, identified by model number 2608BPX34C, is expected to launch later this month in China.
In the Geekbench AI 1.7.0 listing, the Xiaomi 18 Fold scored 629 in Single Precision, 799 in Half Precision, and 634 in Quantized tests.
The listing confirms the presence of the O3 motherboard, pointing to Xiaomi's new Xring O3 flagship chipset.
The Xring O3 is built on a 3nm process and features a 10-core CPU with four cores at 3.15GHz, four at 3.69GHz, and two performance cores reaching 4.36GHz.
The listing also reveals 16GB of RAM and Android 17 out of the box.
These results suggest significant improvements in CPU, GPU, and AI performance for Xiaomi's next foldable.
The same chipset has also appeared in benchmarks for the Xiaomi Pad 9 Pro Max, which scored over 14,000 points in Geekbench's multi-core test.
The tablet, model M367FC, recorded a peak score of 14,319, with another run reaching 14,153 points.
Both the Xiaomi 18 Fold and Pad 9 Pro Max are expected to debut together in the first half of this month.
Meanwhile, the Xiaomi 18 lineup with the Snapdragon 8 Elite Gen 6 may arrive by the end of the month.
