New images and a short video circulating online claim to show the internal hardware of Apple's long-rumored foldable iPhone, weeks before its expected launch.
Shared by X user @LusiRoy7, the video displays a physical circuit board, while an AI-cleaned composite image reveals both sides of the same board.
The prominent chip is reportedly the A20 Pro, which Apple is expected to use in the device.
In the image, the system-on-chip (SoC) and DRAM sit side by side, connected through a redistribution layer instead of being stacked with a traditional interposer.
A redistribution layer is a thin routing structure built onto the package, re-routing connections without the extra silicon interposer seen in stacked designs.
This side-by-side layout could help with heat dissipation and keep the module thin enough for a folding phone.
The chip in the video appears to have its top cover removed, unlike earlier leaked shots of the A20 Pro that showed the usual metal-colored packaging.
If authentic, these would be some of the first physical images claiming to show actual hardware from Apple's foldable.
However, the published image is an AI-cleaned composite, so fine chip markings should be taken with caution, as cleanup tools can sometimes invent or distort text in blurry areas.
Notably, no Apple logos, model numbers, or etchings appear on the shielding cans in either the video or image, and no reliable leakers have backed this up yet.
Like most early hardware leaks, this remains unconfirmed.
The foldable is expected to launch sometime in September, with pricing widely expected to exceed $2,000.
More solid, independently verified details are needed before confirming whether this board is the real deal.
