New photos claiming to show the Xiaomi 18 Fold have surfaced online, offering a closer look at its design.
The phone appears in a red finish similar to the Redmi K100 Pro Max, and its rear camera module stretches horizontally across the top.
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The module houses three lenses and an LED flash, and the images also give a better idea of the device's thickness.
Xiaomi has confirmed the 18 Fold will launch in September, and it will be the first phone to use the company's own XRING O3 chip.
CEO Lei Jun previously confirmed the phone as part of the company's busy September launch schedule.
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XRING O3 at the core
The XRING O3 has already attracted attention, reportedly scoring 5.22 million points on AnTuTu, making it the first mobile chip to cross the 5-million mark.
The processor uses a 10-core CPU design, with all cores classified as big cores instead of combining big and smaller efficiency cores.
Xiaomi says the chip crossed 15,000 points in multi-core testing, a 60% improvement over last year's chip.
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Graphics are handled by the new G2-Ultra NX GPU, which is also a first for Xiaomi, delivering an 85% increase in graphics performance while using 64% less energy.
The XRING O3 is also the first mobile chip to support LPDDR6 memory, pushing memory bandwidth to 113.8GB/s, around 48% higher than the previous XRING O1.
Xiaomi has built the chip around a unified fusion bus architecture and top-tier metal wiring, bringing static latency down to 82ns.
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While those numbers mainly matter in benchmarks, the lower latency should also help the phone feel more responsive in everyday use.
