Leaked documents have revealed early details about Qualcomm's upcoming flagship chip, internally known as SM8975. It is expected to launch as the Snapdragon 8 Elite Gen 6 Pro.
The chip will be manufactured on TSMC's enhanced 2nm-class N2P node, marking Qualcomm's first flagship to move beyond 3nm.
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Despite the denser process, the die size is larger than the previous generation: roughly 134 mm² compared to 126.2 mm².
This increase suggests Qualcomm has packed in more features and complexity.
The CPU configuration uses custom Oryon cores in a 2+3+3 setup: two prime cores, three performance cores, and three efficiency cores.
Exact clock speeds have not been disclosed.
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Graphics and AI Upgrades
On the graphics side, the Pro version gets the Adreno 850 GPU with 18 MB of GMEM, up from the Adreno 840.
It also includes two dedicated Matrix ALU blocks that enable a new feature called AI Frame Fusion.
AI Frame Fusion can perform super-resolution upscaling and generate AI frames to make games smoother while using less power.
These Matrix ALUs and AI Frame Fusion appear to be exclusive to the Pro model.
The regular SM8950 is expected to use a scaled-down Adreno 845 with 12 MB of GMEM and will skip the new AI blocks.
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Cache has also been increased, with a shared 16 MB L2 cache plus 8 MB of system-level cache.
The Pro model will support both LPDDR5X and the newer LPDDR6, while the base version is limited to LPDDR5X.
The Pro version is expected to cost more to manufacture, so it may be reserved for a smaller group of ultra-premium phones.
Qualcomm is set to officially unveil the platform at its Snapdragon Summit in Maui from September 22-24, 2026.
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The event should fill in the remaining details.
