Xiaomi has introduced three new in-house chipsets: the flagship Xring O3, AI-focused Xring O100, and intelligent-driving Xring D100.
The Xring O3 is built on a 3nm process and features a 10-core CPU, delivering up to 60% better performance than its predecessor.
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It also packs a 16-core G2-Ultra NX GPU, with graphics performance up to 85% higher and power efficiency improved by 64%.
Xiaomi claims the chipset scored 5.22 million points on AnTuTu, making it the first mobile SoC to cross the 5-million mark.
The Xring O3 is also Xiaomi's first mobile chip with LPDDR6 memory support, offering bandwidth up to 113.8GB/s.
For AI workloads, it delivers 200 TOPS of tensor performance and 3.13 TFLOPS of vector performance, with NPU performance increased by 45%.
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AI acceleration is distributed across the CPU, GPU, ISP, DPU, and ADSP, with static latency rated at 82ns.
Xiaomi says development took 459 days.
Xiaomi 18 Fold Preorders Go Live
Xiaomi has confirmed that the Xring O3 will power the Xiaomi 18 Fold and Pad 9 Pro Max, both scheduled to launch in September in China.
Ahead of the launch, the company has already started receiving pre-orders for the 18 Fold, which will sport a wide foldable design.
Xring O100 and D100 Target AI and Cars
The Xring O100 is built on a 6nm process and uses a near-memory AI architecture designed to reduce memory bottlenecks.
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It combines vertical chip and memory stacking with millions of high-speed vertical channels to provide bandwidth up to 1.22Tbps.
Xiaomi expects the chipset to be used for on-device AI across phones, cars, and robots.
The Xring D100 focuses on intelligent driving and is Xiaomi's first domestic 3nm intelligent-driving AI chip.
It features a 20-core CPU and 16-core NPU, supporting up to 160GB of unified memory and running AI models with up to 200 billion parameters locally.
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Development is complete, with commercial availability planned for 2027.
